Grinding Polishing Machine RLD 400

Grinding removes saw marks and levels and cleans the specimen surface. Our machinery achieves to have a surface with minimal damage in which the remaining artifacts that keep the surface from being nice and smooth can be removed during polishing in the shortest possible time. In order to achieve this, the process of grind Polishing removes the artifacts of grinding while maintaining the integrity of the sample. Our final aim is to attain a perfectly smooth, deformation free surface. Such a surface is necessary to observe the true microstructure for subsequent interpretation, testing, or analysis, both qualitative and quantitative. The process Lapping is another form of polishing, used to correct minor imperfections of shape and produce a perfectly smooth finish. Lapping process differs from grinding process because it uses a “loose” abrasives instead of bonded abrasives like grinding wheels. The loose abrasives rolls and move freely in all directions, hammering even small particles out on works place.